With the development of switching power supplies, soft switching technology has been widely developed and applied, and many high-efficiency circuit topologies have been studied, mainly PFM-type soft switching topologies and PWM-type soft switching topologies. In recent years, with the widespread application of third-generation semiconductor devices GAN and the continuous development of PD power supplies, this has provided another opportunity for the development of power converters. For half-bridge converters, if properly designed, soft switching conversion can be achieved, so that the switching power supply has higher efficiency and greatly reduces the size of the power supply.

With the development of switching power supplies, soft switching technology has been widely developed and applied, and many high-efficiency circuit topologies have been studied, mainly PFM-type soft switching topologies and PWM-type soft switching topologies. In recent years, with the widespread application of the third-generation semiconductor device GAN and the continuous development of PD power supplies, this has provided another opportunity for the development of power converters. For half-bridge converters, if properly designed, soft switching conversion can be achieved, so that the switching power supply has higher efficiency and greatly reduces the size of the power supply.

The global power adapter market is expanding rapidly, driven by the popularity of smart devices, the rise of new energy vehicles, and the construction of data centers. The growing demand for consumer electronics has driven the development of miniaturized and lightweight adapters.

With the rapid development of electronic equipment, the market has put forward higher requirements for power adapters. High efficiency, miniaturization, and high power density have become key goals in current power adapter design. However, traditional silicon-based power devices have gradually exposed their limitations in high-frequency and high-power applications.

In power electronics, particularly within power adapters, deadtime voltage errors occur during the transition between switching devices when both are off to prevent short circuits. This delay, or "deadtime," introduces voltage distortions that reduce efficiency, causing power losses and heat generation. This is particularly problematic in multilevel inverters utilizing wide-bandgap (WBG) semiconductors, which are critical for high-efficiency power adapters.

In the manufacturing process of power adapters, the surface treatment process is one of the important factors that determine the product appearance, durability, corrosion resistance, etc. Common surface treatment processes include electroplating, spraying, anodizing, brushing, etc. The following is a technical analysis of various surface treatment processes and their applications in power adapters.